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    助焊膏UP78

    助焊膏UP78
    概述參數

    DESCRIPTION

    UP-78 Paste flux can be used for touch up or rework in conjunction with the use of Alpha UP-78 solder paste. This paste flux is identical to the paste flux used to manufacture UP-78 solder paste.

    FEATURES AND BENEFITS

                Designed for use with OSP protected copper pads

                Fully compatible with UP-78 solder paste residue

     

    PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES

    Color Pale, Off White

    Specific Gravity 0.99 (g/cc)

    Viscosity (Spiral/Malcolm), 10 RPM @ 25°C 270-470 Poise

    Acid Number 95-105 mg KOH/g

    Corrosivity, Copper Mirror Pass (L)

    Halide Content 550ppm by IC

    Passes Ag-Chromate test

    Water Content 0.2% Max

    AVAILABILITY

    UP-78 Paste Flux is available in 30cc syringes, 100 and 125 gram jars, and 6” cartridges.

    APPLICATIONS

    Formulated for standard and fine pitch printing through stencil apertures. Suitable for use across a wide variety of process settings, including rework applications with BGA’s and other components. UP-78 Paste Flux is especially suitable for printing on assemblies that have OSP coated copper pads.

    REFLOW

    Clean, dry air or Nitrogen atmosphere. A straight ramp profile at 0.8 – 1.2°C per second ramp rate is recommended. High density assemblies may require preheating within the profile and may be accomplished as follows:

                Ramp @ 60 – 120°C/min to 145 - 160°C.

                Dwell @ 145 - 160°C for 0.5 – 2.0 minutes.

                Ramp @ 1 - 2°C/sec to 210 - 225°C peak temperature. Time above 183°C, 45 – 70 seconds.

                Ramp down to R. T. @ 1.5 – 2.0°C/sec. 


    相關產品:

    Alpha無鉛錫條| Alpha錫膏| Alpha錫絲| Alpha錫片| Alpha助焊劑| OM338| OM340
    資料

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